News
2009
24th EU PV Solar Energy Conference
Displayed highlights:
- MX 152, Inline Metrology
- MX 204-8-49-q, Wafer Geometry
- MX 203-6-41-q, Wafer Geometry
- MX 604-ST, Thickness and Resistivity
- MX 604-B, Resistivity of Silicon blocks
- Waferstudio, 3D Visualization and Analysis
Innovation of 450mm Wafer Warp and Bow Gauge
E+H has succeeded in builting the first Warp and Bow tool for 450mm Wafers.
Innovation of dual sensor technology
E+H has developed a new dual sensor which is able to measure thickness and resistivity at the same time. The first kind of this sensor is built into the new MX 604-ST type.
2008
E+Hs first 450mm tool invented
The MX 1018 is an instrument for the measurement of center thickness and thickness variations of 450 mm silicon wafers.
Meet us at exhibitions
2010
SOLARCON/SEMICON China 2010
» Chunson (Distributor)
March 16th - 18th
Shanghai New International Expo Center
Booth number: not confirmed yet
EXPO ELECTRONICA 2010
» ESTO (Representative)
The 13-th International Exhibition for the Electronic Components and Technological Equipment
April 20th - 22th
Russia, Мoscow, Crocus Expo
Booth number: not confirmed yet
SNEC PV POWER EXPO 2010
» Chunson (Distributor)
May 05th - 07th
Shanghai New International Expo Center
Booth # 5170, Hall W5
SEMICON Taiwan 2010
» Chunson (Distributor)
Sep 08th - 10th
Taipei World Trade Center
Booth number: not confirmed yet
PV Taiwan 2010
» Chunson (Distributor)
Oct 26th - 28th
Taipei World Trade Center
Booth number: not confirmed yet
