News
2010
25th EU PVSEC Flyer with displayed tools
September 6th - 9th
Valencia, Spain
Feria Valencua
Booth L2/H3/C14
E+H represented at the Semicon Russia by Esto
2009
24th EU PV Solar Energy Conference
Displayed highlights:
- MX 152, Inline Metrology
- MX 204-8-49-q, Wafer Geometry
- MX 203-6-41-q, Wafer Geometry
- MX 604-ST, Thickness and Resistivity
- MX 604-B, Resistivity of Silicon blocks
- Waferstudio, 3D Visualization and Analysis
Innovation of 450mm Wafer Warp and Bow Gauge
E+H has succeeded in building the first Warp and Bow tool for 450mm Wafers.
Innovation of dual sensor technology
E+H has developed a new dual sensor which is able to measure thickness and resistivity at the same time. The first kind of this sensor is built into the new MX 604-ST type.
2008
E+Hs first 450mm tool invented
The MX 1018 is an instrument for the measurement of center thickness and thickness variations of 450 mm silicon wafers.
Meet E+H at
exhibitions in 2010
25th European Photovoltaic Solar Energy Conference
» E+H Metrology
together with
» John P. Kummer SARL (Distributor)
September 6th - 9th
Valencia, Spain
Feria Valencia
Booth L2/H3/C14
SEMICON Taiwan 2010
» Chunson (Distributor)
Sep 08th - 10th
Taipei World Trade Center
Booth number: A602, Hall 1
PV Taiwan 2010
» Chunson (Distributor)
Oct 26th - 28th
Taipei World Trade Center
Booth number: not confirmed yet
