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News

2009


24th EU PV Solar Energy Conference

Displayed highlights:

Innovation of 450mm Wafer Warp and Bow Gauge

E+H has succeeded in builting the first Warp and Bow tool for 450mm Wafers.

Innovation of dual sensor technology

E+H has developed a new dual sensor which is able to measure thickness and resistivity at the same time. The first kind of this sensor is built into the new MX 604-ST type.


2008


E+Hs first 450mm tool invented


The MX 1018 is an instrument for the measurement of center thickness and thickness variations of 450 mm silicon wafers.


MX6012
Thickness, Resistivity, P/N Type