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MX 20x series

Contactless Wafer Geometry Gauge

The E+H geometry gauges are based on two heavy plates mounted parallel to each other. Embedded in the plate are a set of capacitive distance sensors. The wafer will be moved manual or automatically between the plates and measured without any movement.

 

Applications

  • Incoming inspection of Wafers
  • R&D
  • Qualification of processes
  • In process control for
    • Thickness (e.g. backend)
    • TTV
    • Warp, FPD
    • Stress

Standard Thickness

Gauge Types Wafer Diameter Sensor Count Thickness Range
MX 203-4-21 2", 3", 4" 5, 13, 21 200 - 800µm
MX 203-6-33 4", 5", 6" 17, 25, 33 300 - 900µm
MX 203-8-37 6", 8" 21, 37 400 - 1000µm
MX 204-8-37 6", 8" 21, 37 400 - 900µm
MX 2012 12" 69 500 - 1000µm
MX 2012-H 12" 69 500 - 900µm

Backside Grinding

Gauge Types Wafer Diameter Sensor Count Thickness Range
MX 203-6-33-B 4", 5", 6" 17, 25, 33 100 - 700µm
MX 203-8-37-B 6", 8" 21, 37 200 - 700µm
MX 203-58-37 5", 6", 8" 13, 21, 37 200 - 800µm
MX 203-8-49-B 4", 5", 6", 8" 17, 25, 33, 49 150 - 650µm
MX 204-8-37-B 6", 8" 21, 37 200 - 700µm
MX 204-6-13-V 5", 6" 5, 13 100 - 700µm
MX 204-8-21-V 6", 8" 13, 21 100 - 700µm
MX 2013 8", 12" 21, 37 100 - 750µm

High Resistivity Material

Gauge Types Wafer Diamenter Sensor Counts Thickness range
MX 203-4-37-Q 2", 3", 4" 21, 37 300 - 800µm
MX 203-6-33-Q 3", 4", 5", 6" 9, 13, 21, 33 300 - 800µm

Solar

Gauge Types Wafer Diamenter Sensor Counts Thickness Range
MX 203-6-41-q 100x100, 125x125, 156x156 21, 33, 41 160 - 700µm
MX 204-8-25-q 125x125, 156x156 17, 25 150 - 600µm
MX 204-8-49-q 125x125, 156x156 25, 49 100 - 600µm
MX 203 with manual drawer (Semiconductor)
MX 203 with manual drawer (Solar)
MX 204 with automatic drawer
MX 2012, Warp (black points = measurement points)