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MX 203-8-49-B

Application

Fine mesh contactless geometry gauge for thin 100 - 200mm silicon wafers.

High throughput: the MX203-8-37-B gauges with its 49 measuring points every wafer within max. 12 seconds. It controls thickness, bow and warp after back side grinding. Flexible wafer size adjustment by various centering-frames. Comes with our powerful MX-NT operating software.


Measurement type

Thickness Flatness (TTV) Bow Warp

Features

Wafer Diameter 100-200mm
Accuracy ±0.6 µm
Resolution 50nm
Thickness range 150 - 650 µm
Automatic wafer no
Software MXNT

WHICH TOOL
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Peter Michel

+49 (0)721 83118-17
sales(at)eh-metrology.com

 

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