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MX 30x

Contactless One-Point Wafer Thickness Gauge

The MX30x series are manual one-point Thickness gauges for silicon wafers.

 

Applications

  • usefull in a big range of application
  • R&D
  • In process control for
    • Thickness
    • TTV

Unframed Wafers

Gauge Types Wafer Diameter Thickness Range
MX 301-8 20 - 200mm 200 - 1000µm
MX 301-8-S 75 - 200mm 300 - 1800µm
MX 3012 75 - 300mm 200 - 1000µm

Framed Wafers

Gauge Types Wafer Diameter Thickness Range
MX 3014 200 , 300mm 0 - 1100µm