The E+H geometry gauges are based on two heavy plates mounted parallel to each other. Embedded in the plate are a set of capacitive distance sensors. The wafer will be moved manual or automatically between the plates and measured without any movement.
- Incoming inspection of Wafers
- R&D
- Qualification of processes
- In process control for
- Thickness (e.g. backend)
- TTV
- Warp, FPD
- Stress
| Gauge Types |
Wafer Diameter |
Sensor Count |
Thickness Range |
| MX 203-4-21 |
2", 3", 4" |
5, 13, 21 |
200 - 800µm |
| MX 203-6-33 |
4", 5", 6" |
17, 25, 33 |
300 - 900µm |
| MX 203-8-37 |
6", 8" |
21, 37 |
400 - 1000µm |
| MX 204-8-37 |
6", 8" |
21, 37 |
400 - 900µm |
| MX 2012 |
12" |
69 |
500 - 1000µm |
| MX 2012-H |
12" |
69 |
500 - 900µm |
| Gauge Types |
Wafer Diameter |
Sensor Count |
Thickness Range |
| MX 203-6-33-B |
4", 5", 6" |
17, 25, 33 |
100 - 700µm |
| MX 203-8-37-B |
6", 8" |
21, 37 |
200 - 700µm |
| MX 203-58-37 |
5", 6", 8" |
13, 21, 37 |
200 - 800µm |
| MX 203-8-49-B |
4", 5", 6", 8" |
17, 25, 33, 49 |
150 - 650µm |
| MX 204-8-37-B |
6", 8" |
21, 37 |
200 - 700µm |
| MX 204-6-13-V |
5", 6" |
5, 13 |
100 - 700µm |
| MX 204-8-21-V |
6", 8" |
13, 21 |
100 - 700µm |
| MX 2013 |
8", 12" |
21, 37 |
100 - 750µm |
| Gauge Types |
Wafer Diamenter |
Sensor Counts |
Thickness range |
| MX 203-4-37-Q |
2", 3", 4" |
21, 37 |
300 - 800µm |
| MX 203-6-33-Q |
3", 4", 5", 6" |
9, 13, 21, 33 |
300 - 800µm |
| Gauge Types |
Wafer Diamenter |
Sensor Counts |
Thickness Range |
| MX 203-6-41-q |
100x100, 125x125, 156x156 |
21, 33, 41 |
160 - 700µm |
| MX 204-8-25-q |
125x125, 156x156 |
17, 25 |
150 - 600µm |
| MX 204-8-49-q |
125x125, 156x156 |
25, 49 |
100 - 600µm |
