Metrology Solutions for the
Semiconductor and PV/Solar
World
MX 7012
For:
Thickness, TTV, Warp, Waviness, Roughness*
Features:
- Thickness range 780 - 970µm
- Wafer diameter 300mm
- Software MXNT
- Thickness Accuracy ±0.3µm
- Resolution 2nm
- Spartial resolution 0.2mm
- Warp Accuracy ±3µm
- Waviness Accuracy ±1µm
- Optional: Optical roughness scan