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MX 301-8

Application

Easy one-point thickness gauge for 30–200mm silicon wafers.

The MX301 is a robust and stable instrument for quick and simple manual thickness gauge of a large variety of silicon wafers. Adaptable to different thickness ranges within a few seconds. With customized exchangeable shims and an easy one-click calibration. With integrated 5-digit display. Workes as stand-alone or connected to a PC via serial interface, which allows collecting data of multiple measurements, calculating flatness (TTV), mean value or standard deviation of single wafers or of complete wafer lots.


Measurement type

Thickness

Features

Wafer Diameter up to 200mm
Thickness Accuracy ±0.5µm
Resolution 10nm
Dynamic range 800µm
Thickness range default 200 - 1000 µm
Switchable to measure high res material yes
Software EHMaster

WHICH TOOL
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Peter Michel

+49 (0)721 83118-17
sales(at)eh-metrology.com

 

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