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MX 1012

Application

High-resolution thickness and flatness (TTV) gauge for 200–300mm silicon wafers.

Easy adaption to different thickness ranges within a few seconds. Integration into automatic robotic sorter systems possible.
The MX1012 is ideally suited for research & development, qualification of processes, and process control of thickness and flatness (TTV) especially after grinding and lapping. A pair of capacitive sensors samples four radial profiles (45 degrees) on every wafer which consist of hundreds of local thickness
values. If necessary for your application, the four standard scans can be simply increased to reach an even higher measuring coverage. Comes with our powerful MX-NT operating software.

 


Measurement type

Thickness Flatness (TTV)

Features

Wafer Diameter 200mm, 300mm
Accuracy ±0.1 µm
Resolution 10nm
Spartial resolution 1mm
Scans up to 8
Software MXNT

Product comparison

Wafer Diameter
Accuracy
Resolution
Spartial Resolution
Scans
Dynamic Range
Software
4“, 5“, 6“
±0.1 µm
10nm
1mm
4
100 or 350µm
MXNT
6“, 8“
±0.1 µm
10nm
1mm
4
100 or 350µm
MXNT
8", 12"
±0.1 µm
10nm
1mm
up to 8
100 or 350µm
MXNT
12", 18"
±0.3 µm
10nm
1mm
up to 8
100 or 350µm
MXNT
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WHICH TOOL
fits my needs?

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E+H Metrology is committed to protecting and respecting your privacy. We only use your personal information to administer your account and to provide the products and services you have requested.

Peter Michel

+49 (0)721 83118-17
sales(at)eh-metrology.com

 

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