MX 1012

Application

High-resolution thickness and flatness (TTV) gauge for 200–300mm silicon wafers.

Easy adaption to different thickness ranges within a few seconds. Integration into automatic robotic sorter systems possible.
The MX1012 is ideally suited for research & development, qualification of processes, and process control of thickness and flatness (TTV) especially after grinding and lapping. A pair of capacitive sensors samples four radial profiles (45 degrees) on every wafer which consist of hundreds of local thickness
values. If necessary for your application, the four standard scans can be simply increased to reach an even higher measuring coverage. Comes with our powerful MX-NT operating software.