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MX 203-6-33

Application

Fast contactless geometry gauge for 100–150mm silicon wafers.

High throughput: the MX203-6-33 gauges with its 33 measuring points every wafer within max. 7 seconds. It controls thickness, bow and warp. Wafer stress evaluation is optionally available. Flexible wafer size adjustment by various centering-frames. Comes with our powerful MX-NT operating software.


Measurement type

Thickness Flatness (TTV) Bow Warp

Features

Wafer Diameter 100mm, 125mm, 150mm
Thickness Accuracy ±0.6 µm
Resolution 50nm
Thickness range 300 - 900 µm
Automatic wafer no
Software MXNT

WHICH TOOL
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Peter Michel

+49 (0)721 83118-17
sales(at)eh-metrology.com

 

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