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MX 203-4-21


Fast contactless geometry gauge for 2–4" silicon wafers.

High throughput: the MX203-4-21 gauges with its 21 measuring points every wafer within max. 5 seconds. It controls thickness, bow and warp. Wafer stress evaluation is optionally available. Flexible wafer size adjustment by various centering-frames. Comes with our powerful MX-NT operating software.

Measurement type

Thickness Flatness (TTV) Bow Warp


Wafer Diameter 50mm, 75mm, 100mm
Thickness Accuracy ±0.5 µm
Resolution 50nm
Thickness range 200 - 800 µm
Automatic wafer no
Software MXNT

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Peter Michel

+49 (0)721 83118-17


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