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MX 2013


Automatable geometry gauge for thin and standard 200mm or 300mm silicon wafers.

The MX2013 works as semi-automated stand-alone station. With its 37 measuring points it gauges 300mm wafers within 50 seconds. It controls thickness, bow and warp in high resolution (Corresponds with Sori). System optional available for 200mm wafer measuring. Comes with our powerful MX-NT operating Software.

Measurement type

Thickness Flatness (TTV)


Wafer Diameter 200mm, 300mm
Accuracy ±1 µm
Resolution 0.1µm
Thickness range 100 - 750 µm
Automatic wafer geometry gauge yes
Software MXNT

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Peter Michel

+49 (0)721 83118-17


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