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MX 302
Application
The MX 302 measures a high resulution thickness scan. Prepared for integration into an automated etching system. Automatic measuring of wafers in the carrier.
Measurement type
Features
| Wafer Diameter | 150mm, 200mm |
| Thickness Accuracy | ±0.5µm |
| Resolution | 0.1µm |
| Dynamic range | customized |
| Thickness range | up to 3 |
| Software | EHMaster |
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