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The MX 302 measures a high resulution thickness scan. Prepared for integration into an automated etching system. Automatic measuring of wafers in the carrier.
Wafer Diameter | 150mm, 200mm |
Thickness Accuracy | ±0.5µm |
Resolution | 0.1µm |
Dynamic range | customized |
Thickness range | up to 3 |
Software | EHMaster |
You have questions, wishes or an order?
We will be happy to consult you personally.