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MX 102-8

Application

High-resolution thickness and flatness (TTV) gauge for 150–200mm silicon wafers

Easy adaption to different thickness ranges within a few seconds. Integration into automatic robotic sorter systems possible.
The MX102-8 is ideally suited for research & development, qualification of processes, and process control of thickness and flatness (TTV).
A pair of capacitive sensors samples four radial profiles (45 degrees) on every wafer. One such profile consists of 200 local thickness
values and is offset by 45 degrees relative to the neighbouring profile. Comes with our powerful MX-NT operating software.


Measurement type

Thickness Flatness (TTV)

Features

Wafer Diameter 150mm, 200mm
Accuracy ±0.1 µm
Resolution 10nm
Spartial resolution 1mm
Scans 4
Software MXNT

Product comparison

Wafer Diameter
Accuracy
Resolution
Spartial Resolution
Scans
Dynamic Range
Software
4“, 5“, 6“
±0.1 µm
10nm
1mm
4
100 or 350µm
MXNT
6“, 8“
±0.1 µm
10nm
1mm
4
100 or 350µm
MXNT
8", 12"
±0.1 µm
10nm
1mm
up to 8
100 or 350µm
MXNT
12", 18"
±0.3 µm
10nm
1mm
up to 8
100 or 350µm
MXNT
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WHICH TOOL
fits my needs?

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Peter Michel

+49 (0)721 83118-17
sales(at)eh-metrology.com

 

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