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MX 204-8-21-V


Automatable geometry gauge for thin 150mm and 200mm silicon wafers.

The MX204-8-21-V works as manually loaded stand-alone tool as well as fully integrated in automated robot systems. With its 21 measuring points it controls thickness, bow and warp after back side grinding. Throughput at least 80 wafers per hour. Different wafer sizes can be used without changeover thanks to the upstream centering station. Comes with our powerful MX-NT Software.

Measurement type

Thickness Flatness (TTV)


Wafer Diameter 150mm, 200mm
Accuracy ±1 µm
Resolution 0.1µm
Thickness range 100 - 700 µm
Automatic wafer geometry gauge yes
Bow & Warp include gravity connection no
Software MXNT

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Peter Michel

+49 (0)721 83118-17


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