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MX 203-6-41-q


Fast contactless geometry gauge for 100–156mm solar wafers.

High throughput: the MX203-6-41-q gauges with its 41 measuring points every wafer within max. 8 seconds. It controls thickness, bow and warp. Flexible wafer size adjustment by various centering-frames. Comes with our powerful MX-NT operating Software.

Measurement type

Thickness Flatness (TTV) Bow Warp Sori


Wafer Diameter 100mm, 125mm, 156mm
Thickness Accuracy ±0.5 µm
Resolution 50nm
Thickness range 160 - 700 µm
Automatic wafer no
Software MXNT

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Heiko Rings

+49 (0)721 83118-16


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