EN Deutsch Chinesisch

MX 204-6-33


The MX204-6-33 works as manually loaded stand-alone tool as well as fully integrated in automated robot systems. With its 33 measuring points it controls thickness, bow and warp in high resolution. Wafer stress evaluation is optionally available. Different wafer sizes can be used without changeover thanks to the upstream centering station. Comes with our powerful MX-NT operating software.

Measurement type

Thickness Flatness (TTV)


Wafer Diameter 125mm, 150mm (100mm is optional)
Thickness Accuracy ±0.6 µm
Resolution 50nm
Thickness range 100 - 700 µm
Automatic wafer geometry gauge yes
Bow & Warp include gravity connection no
Software MXNT

fits my needs?

You have questions, wishes or an order?
We will be happy to consult you personally.

E+H Metrology is committed to protecting and respecting your privacy. We only use your personal information to administer your account and to provide the products and services you have requested.

Peter Michel

+49 (0)721 83118-17


Scroll down for more