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MX 3014-Z

Application

OEM integrated thickness gauge for 100-200mm silicon and insulating wafers.

The MX3014-Z  is an in-line module for belt or robot transported wafers. It gauges thickness on the fly between automated manufacturing processes. Completely self-calibrating for effortless usage.


Measurement type

Thickness

Features

Wafer Diameter 100 - 200mm
Accuracy ±1µm
Resolution 0.1µm
Thickness range 200 - 800 µm
Software EHMaster

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Peter Michel

+49 (0)721 83118-17
sales(at)eh-metrology.com

 

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