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![Peter Michel, E+H Metrology Portrait of Peter Michel, Product Sales Manager of E+H Metrology](/fileadmin/_processed_/2/a/csm_Peter-Michel-Knt-web_689726ce4b.jpg)
Fast contactless geometry gauge for thin 125– 200mm silicon wafers.
High throughput: the MX203-58-37-B gauges with its 37 measuring points every wafer within max. 8 seconds. It controls thickness, bow and warp after back side grinding. Flexible wafer size adjustment by various centering-frames. Comes with our powerful MX-NT operating software.
Wafer Diameter | 125mm, 150mm, 200mm |
Thickness Accuracy | ±2.0 µm |
Resolution | 75nm |
Thickness range | 200 - 800 µm |
Automatic wafer | no |
Bow & Warp include gravity connection | no |
Software | MXNT |
You have questions, wishes or an order?
We will be happy to consult you personally.