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MX 203-58-37-B


Fast contactless geometry gauge for thin 125– 200mm silicon wafers.

High throughput: the MX203-58-37-B gauges with its 37 measuring points every wafer within max. 8 seconds. It controls thickness, bow and warp after back side grinding. Flexible wafer size adjustment by various centering-frames. Comes with our powerful MX-NT operating software.

Measurement type

Thickness Flatness (TTV) Bow Warp


Wafer Diameter 125mm, 150mm, 200mm
Thickness Accuracy ±2.0 µm
Resolution 75nm
Thickness range 200 - 800 µm
Automatic wafer no
Bow & Warp include gravity connection no
Software MXNT

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Peter Michel

+49 (0)721 83118-17


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