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![Peter Michel, E+H Metrology Portrait of Peter Michel, Product Sales Manager of E+H Metrology](/fileadmin/_processed_/2/a/csm_Peter-Michel-Knt-web_689726ce4b.jpg)
Combined thickness and resistivity gauge for 200 mm and 300 mm silicon wafers.
The MX6012 is designed to characterize silicon wafers. It combines contactless thickness, resistivity and P/N dotation sensors. In addition to the center measurement, up to 15 additional points for each half scan can defined. Optionally an identical scan after 90° rotation. To be connected to a PC via serial interface. Comes with our powerful MX-NT operating software. Integration into automatic robotic sorter systems possible.
Wafer Diameter | 200, 300 mm |
Thickness | 600 – 900 μm |
Max. Warp | 100 μm |
Resistivity | 0.001 – 200 Ohm·cm |
Type check | 0.020 – 200 Ohm·cm |
Software | MXNT |
You have questions, wishes or an order?
We will be happy to consult you personally.