EN Deutsch Chinesisch

MX 6012


Combined thickness and resistivity gauge for 200 mm and 300 mm silicon wafers.

The MX6012 is designed to characterize silicon wafers. It combines contactless thickness, resistivity and P/N dotation sensors. In addition to the center measurement, up to 15 additional points for each half scan can defined. Optionally an identical scan after 90° rotation. To be connected to a PC via serial interface. Comes with our powerful MX-NT operating software. Integration into automatic robotic sorter systems possible.

Measurement type

Thickness Flatness (TTV) Resistivity P/N Dotation


Wafer Diameter 200, 300 mm
Thickness 600 – 900 μm
Max. Warp 100 μm
Resistivity 0.001 – 200 Ohm·cm
Type check 0.020 – 200 Ohm·cm
Software MXNT

fits my needs?

You have questions, wishes or an order?
We will be happy to consult you personally.

E+H Metrology is committed to protecting and respecting your privacy. We only use your personal information to administer your account and to provide the products and services you have requested.

Peter Michel

+49 (0)721 83118-17


Scroll down for more