EN Deutsch Chinesisch

Home > Products > Manual Tools > MX10 Series > MX 102-6

MX 102-6

Application

High-resolution thickness and flatness (TTV) gauge for 100–150mm silicon wafers.

Easy adaption to different thickness ranges within a few seconds. Integration into automatic robotic sorter systems possible.

The MX102-6 is ideally suited for research & development, qualification of processes, and process control of thickness and flatness (TTV). A pair of capacitive sensors samples four radial profiles (45 degrees) on every wafer.

One such profile consists of 200 local thickness values and is offset by 45 degrees relative to the neighbouring profile. Comes with our powerful MX-NT operating software.

Measurement type

Thickness Flatness (TTV)

Features

Wafer Diameter 100mm, 125mm, 150mm
Accuracy ±0.1 µm
Resolution 10nm
Spartial resolution 1mm
Scans 4
Software MXNT

Product comparison

MX 102-6

MX 102-8

MX 1012

MX 1018
Wafer Diameter
Accuracy
Resolution
Spartial Resolution
Scans
Dynamic Range
Software
4“, 5“, 6“
±0.1 µm
10nm
1mm
4
100 or 350µm
MXNT
6“, 8“
±0.1 µm
10nm
1mm
4
100 or 350µm
MXNT
8", 12"
±0.1 µm
10nm
1mm
up to 8
100 or 350µm
MXNT
12", 18"
±0.3 µm
10nm
1mm
up to 8
100 or 350µm
MXNT
Scroll down for more

Related products

Scroll down for more

WHICH TOOL
fits my needs?

You have questions, wishes or an order?
We will be happy to consult you personally.


E+H Metrology is committed to protecting and respecting your privacy. We only use your personal information to administer your account and to provide the products and services you have requested.

Portrait of Peter Michel, Product Sales Manager of E+H Metrology

Peter Michel

+49 (0)721 83118-17
sales(at)eh-metrology.com

 

Scroll down for more
Search form