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MX 3012


Easy one-point thickness gauge for 75–300mm silicon wafers.

The MX3012 is a robust and stable instrument for quick and simple manual thickness gauge of a large variety of silicon wafers. Adaptable to different thickness ranges within a few seconds. With an easy one-click calibration. Integrated 5-digit display. Workes as stand-alone or connected to a PC via serial interface, which allows collecting data of multiple measurements, calculating flatness (TTV), mean value or standard deviation of single wafers or of complete wafer lots.

Measurement type



Wafer Diameter up to 300mm
Accuracy ±0.5µm
Resolution 10nm
Dynamic range 800µm
Thickness range default 200 - 1000 µm
Switchable to measure high res material yes
Software EHMaster

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Peter Michel

+49 (0)721 83118-17


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