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MX 152/153

Application

OEM integrated thickness and resistivity gauge for 125 mm, 156 mm up to 230 mmm solar wafers.

The MX152/153 is an in-line module for belt-transported wafers. It gauges thickness, flatness (TTV) and optionally resistivity and P/N dotation on the fly between automated manufacturing processes. Consists of Measurement module, electronic rack and controlling computer. Measurement values will be tranfered to a host computer by ethernet and TCP/IP.


Measurement type

Thickness Flatness (TTV) Resistivity P/N Dotation

Features

Wafer Size 125x125 mm and 156x156 mm and up to 230 mm
Accuracy ±0.5µm
Resolution 0.1µm
Thickness range 100 - 300 µm
Software EHMaster

MX 152 & MX 153

  3-lines
thickness
1-lines
thickness
3-lines
Sheet resistance
1-line
Sheet resistance
P/N
MX 152        
MX 152-PN      
MX 152-R      
MX 152-R-PN    
MX 152-3R      
MX 152-3R-PN    
           
MX 153-T        
MX 153-T-PN      
MX 153-R        
MX 153-R-PN      
MX 153-3R        
MX 153-3R-PN      
MX 153-RT      
MX 153-RT-PN    
MX 153-3RT      
MX 153-3RT-PN    
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E+H Metrology is committed to protecting and respecting your privacy. We only use your personal information to administer your account and to provide the products and services you have requested.

Heiko Rings

+49 (0)721 83118-16
sensors(at)eh-metrology.com

 

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