MX 204-6-13-V

Application

Automatable geometry gauge for thin 100–150mm silicon wafers.

The MX204-6-13-V works as manually loaded stand-alone tool as well as fully integrated in automated robot systems. With its 13 measuring points it controls thickness, bow and warp after back side grinding. Throughput at least 80 wafers per hour. Different wafer sizes can be used without changeover thanks to the upstream centering station. Comes with our powerful MX-NT operating software.