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MX 203-8-37


Fast contactless geometry gauge for 150mm and 200mm silicon wafers.

High throughput: the MX203-6-33 gauges with its 37 measuring points every wafer within max. 8 seconds. It controls thickness, bow and warp. Wafer stress evaluation is optionally available. Flexible wafer size adjustment by various centering-frames. Comes with our powerful MX-NT operating software.

Measurement type

Thickness Flatness (TTV) Bow Warp


Wafer Diameter 150mm, 200mm
Thickness Accuracy ±0.5 µm
Resolution 50nm
Thickness range 400 - 1000 µm
Automatic wafer no
Software MXNT

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Peter Michel

+49 (0)721 83118-17


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