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![Peter Michel, E+H Metrology Portrait of Peter Michel, Product Sales Manager of E+H Metrology](/fileadmin/_processed_/2/a/csm_Peter-Michel-Knt-web_689726ce4b.jpg)
Fast contactless geometry gauge for 150mm and 200mm silicon wafers.
High throughput: the MX203-6-33 gauges with its 37 measuring points every wafer within max. 8 seconds. It controls thickness, bow and warp. Wafer stress evaluation is optionally available. Flexible wafer size adjustment by various centering-frames. Comes with our powerful MX-NT operating software.
Wafer Diameter | 150mm, 200mm |
Thickness Accuracy | ±0.5 µm |
Resolution | 50nm |
Thickness range | 400 - 1000 µm |
Automatic wafer | no |
Software | MXNT |
You have questions, wishes or an order?
We will be happy to consult you personally.