EN Deutsch Chinesisch

MX70 – HIGH-RESOLUTION
thickness and surface profiler

Scroll down for more
Scroll down for more

The MX 70x series measures thickness, warp, waviness and roughness for silicon wafers. It is usable for nanotopography. Available as a module on automatic robot systems.

Measurement types for the MX 70 Series:

Thickness Waviness Roughness Nanotopography
Scroll down for more

Home > Products > Manual Tools > MX70 Series

MX70 Series
Category
Filter
Reset all filters
Filter
Reset all filters
Cancel
Ok
Wafer Size
Characteristics
Wafer Properties
Wafer Form
Compatible with
Reset all filters<

MX 7012

High resolution thickness and surface profiler for etched 300mm silicon wafers.

MX 7018

High resolution thickness and surface profiler for as-sawn 450mm silicon wafers.

No Match? No Problem!

We are able to customize our products to a wide range of technical specifications. Which are yours?

WHICH TOOL
fits my needs?

You have questions, wishes or an order?
We will be happy to consult you personally.


E+H Metrology is committed to protecting and respecting your privacy. We only use your personal information to administer your account and to provide the products and services you have requested.

Portrait of Peter Michel, Product Sales Manager of E+H Metrology

Peter Michel

+49 (0)721 83118-17
sales(at)eh-metrology.com

 

Scroll down for more
Search form