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MX70 – HIGH-RESOLUTION
thickness and surface profiler

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The MX 70x series measures thickness, warp, waviness and roughness for silicon wafers. It is usable for nanotopography. Available as a module on automatic robot systems.

Measurement types for the MX 70 Series:

Thickness Waviness Roughness Nanotopography
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Home > Products > Manual Tools > MX70 Series

MX70 Series
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Wafer Size
Characteristica
Wafer Properties
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Compatible with
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MX 7012

High resolution thickness and surface profiler for etched 300mm silicon wafers.

MX 7018

High resolution thickness and surface profiler for as-sawn 450mm silicon wafers.

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Portrait of Peter Michel, Product Sales Manager of E+H Metrology

Peter Michel

+49 (0)721 83118-17
sales(at)eh-metrology.com

 

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