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MX 204-8-73-q


Automatable geometry gauge for 182 and 210mm solar wafers.

The MX204-8-73-q works as manually loaded stand-alone tool as well as fully integrated in automated robot systems. With its 73 measuring points it controls thickness, bow and warp in high resolution. Different wafer sizes can be used without changeover thanks to the upstream centering station. Comes with our powerful MX-NT operating software.

Measurement type

Thickness Flatness (TTV) Bow Warp Sori


Wafer Diameter 182mm, 210mm
Thickness Accuracy ±0.5 µm
Resolution 75nm
Thickness range 200 - 600 µm
Automatic wafer geometry gauge yes
Software MXNT

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Heiko Rings

+49 (0)721 83118-16


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