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MX 2018-W


Automatable bow and warp gauge for 450mm silicon wafers.

The MX2018-W manages the difficult 450mm size wafers. Upright position measuring avoids the otherwise enormous gravity-induced sag. With its 73 measuring points it controls center thickness, bow and warp in high resolution. For covering all geometry properies we recommend using MX2018-W in combination with MX1018. Within a robot sorter these both modules can measure two wafers simultaneously without detraction of the throughput. Comes with our powerful MX-NT operating software.

Measurement type

Thickness Flatness (TTV)


Wafer Diameter 300mm, 450mm
Warp Accuracy ±5 µm + 5% of reading
Warp Precision ±0.5 µm + 1% of reading
Warp range 800 µm
Automatic wafer geometry gauge yes
Software MXNT

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Peter Michel

+49 (0)721 83118-17


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