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MX 204-8-21-TKO2


Automatable geometry gauge for thin 150mm and 200mm Taiko silicon wafers.

The MX204-8-21-TKO2 works as manually loaded stand-alone tool as well as fully integrated in automated robot systems. Especially for Taiko wafers, with or without protective tape. With its 21 measuring points it controls thickness, bow and warp after back side grinding. Throughput at least 80 wafers per hour. Different wafer sizes can be used without changeover thanks to the upstream centering station. Comes with our powerful MX-NT operating software.

Measurement type

Thickness Flatness (TTV)


Wafer Diameter 150mm, 200mm
Accuracy ±1 µm
Resolution 0.1µm
Thickness range 50 - 500 µm (TAIKO ring up to 750 µm)
Automatic wafer geometry gauge yes
Bow & Warp include gravity connection no
Software MXNT

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Peter Michel

+49 (0)721 83118-17


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