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![Peter Michel, E+H Metrology Portrait of Peter Michel, Product Sales Manager of E+H Metrology](/fileadmin/_processed_/2/a/csm_Peter-Michel-Knt-web_689726ce4b.jpg)
Combined thickness and resistivity gauge for 150mm and 200mm silicon wafers.
The MX608 is designed to characterize silicon wafers. It combines contactless thickness, resistivity and P/N dotation sensors. Automatic move-in and turn of the wafer allows up to 18 scans of each wafer. To be connected to a PC via serial interface. Comes with our powerful MX-NT operating software. Integration into automatic robotic sorter systems possible.
Wafer Diameter | 150mm, 200mm |
Thickness | 500 – 800 μm |
Max. Warp | 100 μm |
Resistivity | 0.001 – 200 Ohm·cm |
Type check | 0.020 – 200 Ohm·cm |
Software | MXNT |
You have questions, wishes or an order?
We will be happy to consult you personally.