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MX 608


Combined thickness and resistivity gauge  for 150mm and 200mm silicon wafers.

The MX608 is designed to characterize silicon wafers. It combines contactless thickness, resistivity and P/N dotation sensors. Automatic move-in and turn of the wafer allows up to 18 scans of each wafer. To be connected to a PC via serial interface. Comes with our powerful MX-NT operating software.  Integration into automatic robotic sorter systems possible.

Measurement type



Wafer Diameter 150mm, 200mm
Thickness 500 – 800 μm
Max. Warp 100 μm
Resistivity 0.001 – 200 Ohm·cm
Type check 0.020 – 200 Ohm·cm
Software MXNT

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Peter Michel

+49 (0)721 83118-17


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