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MX 204-8-37


Automatable geometry gauge for 150mm and 200mm silicon wafers.

The MX204-8-37 works as manually loaded stand-alone tool as well as fully integrated in automated robot systems. With its 37 measuring points it controls thickness, bow and warp in high resolution. Wafer stress evaluation is optionally available. Different wafer sizes can be used without changeover thanks to the upstream centering station. Comes with our powerful MX-NT operating software.

Measurement type

Thickness Flatness (TTV)


Wafer Diameter 150mm, 200mm
Thickness Accuracy ±0.5 µm
Resolution 50nm
Thickness range 400 - 900 µm
Automatic wafer geometry gauge yes
Software MXNT

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Peter Michel

+49 (0)721 83118-17


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