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MX 3014


Easy one-point thickness gauge for thin, framed 200mm and 300mm silicon wafers.

The MX3012 is a robust and stable instrument for quick and simple manual thickness gauge. Especially for thin wafers, unframed and framed with dicing tape or backgrind tape. Simple handling without the tape thickness nor the tape's dielectric constant. Light barriers avoid mismeasurement at the edges. Fully self-calibrating without the need for gauge blocks nor reference wafers. Integrated 5-digit display. Workes as stand-alone or connected to a PC via serial interface, which allows collecting data of multiple measurements, calculating flatness (TTV), mean value or standard deviation of single wafers or of complete wafer lots.

Measurement type



Wafer Diameter 200mm and 300mm
Thickness Accuracy ±0.5µm
Resolution 0.1µm
Thickness range 0 - 1600µm
Software EHMaster

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Peter Michel

+49 (0)721 83118-17


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