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MX 7018


The MX7018 is designed to control thickness, flatness (TTV), warp, waviness and roughness after wire sawing. Capacitive sensors scan a diagonal cut through the center of the wafer. On the sides where the saw wire enters and exits, thickness and roughness are measured simultaneously. (The latter with an opto-electronic measuring system.) Available asin-line integrated module or as hand-loaded stand-alone for spot checks. Comes with our powerful MX-NT operating software.

Measurement type



Wafer diameter 450 mm
Thickness range 780 - 970 μm
Software MXNT

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Peter Michel

+49 (0)721 83118-17


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