Related products
WHICH TOOL
fits my needs?
You have questions, wishes or an order?
We will be happy to consult you personally.
The MX7018 is designed to control thickness, flatness (TTV), warp, waviness and roughness after wire sawing. Capacitive sensors scan a diagonal cut through the center of the wafer. On the sides where the saw wire enters and exits, thickness and roughness are measured simultaneously. (The latter with an opto-electronic measuring system.) Available asin-line integrated module or as hand-loaded stand-alone for spot checks. Comes with our powerful MX-NT operating software.
Wafer diameter | 450 mm |
Thickness range | 780 - 970 μm |
Software | MXNT |
You have questions, wishes or an order?
We will be happy to consult you personally.