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Fine mesh contactless geometry gauge for thin 100 - 200mm silicon wafers.
High throughput: the MX203-8-37-B gauges with its 49 measuring points every wafer within max. 12 seconds. It controls thickness, bow and warp after back side grinding. Flexible wafer size adjustment by various centering-frames. Comes with our powerful MX-NT operating software.
Wafer Diameter | 100-200mm |
Accuracy | ±0.6 µm |
Resolution | 50nm |
Thickness range | 150 - 650 µm |
Automatic wafer | no |
Software | MXNT |
You have questions, wishes or an order?
We will be happy to consult you personally.