EN Deutsch Chinesisch

MX 203-8-49-B


Fine mesh contactless geometry gauge for thin 100 - 200mm silicon wafers.

High throughput: the MX203-8-37-B gauges with its 49 measuring points every wafer within max. 12 seconds. It controls thickness, bow and warp after back side grinding. Flexible wafer size adjustment by various centering-frames. Comes with our powerful MX-NT operating software.

Measurement type

Thickness Flatness (TTV) Bow Warp


Wafer Diameter 100-200mm
Accuracy ±0.6 µm
Resolution 50nm
Thickness range 150 - 650 µm
Automatic wafer no
Software MXNT

fits my needs?

You have questions, wishes or an order?
We will be happy to consult you personally.

E+H Metrology is committed to protecting and respecting your privacy. We only use your personal information to administer your account and to provide the products and services you have requested.

Peter Michel

+49 (0)721 83118-17


Scroll down for more