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MX 301-AC


Easy one-point thickness gauge for 30–200mm semiconducting and metallic materials.

The MX301-AC is a robust and stable instrument for quick and simple manual thickness gauge. Made for a large variety of silicon and solar wafers and pieces of semiconducting or metallic materials. Fully self-calibrating without the need for gauge blocks nor reference wafers. With integrated 5-digit display. Workes as stand-alone or connected to a PC via serial interface, which allows collecting data of multiple measurements, calculating flatness (TTV), mean value or standard deviation of single wafers or of complete wafer lots.

Measurement type

Thickness Flatness (TTV)


Wafer Diameter 30mm, 50mm, 75mm, 100mm, 156mm
Accuracy ± 0.5 µm +0.05 %
Thickness range 50 - 1600 µm
Automatic wafer geometry gauge no
Software MXNT

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Heiko Rings

+49 (0)721 83118-16


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