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MX 203-8-37-B
Application
Fast contactless geometry gauge for thin 150mm and 200mm silicon wafers.
High throughput: the MX203-8-37-B gauges with its 37 measuring points every wafer within max. 8 seconds. It controls thickness, bow and warp after back side grinding. Flexible wafer size adjustment by various centering-frames. Comes with our powerful MXNT operating software.
Measurement type
Features
| Wafer Diameter | 15mm, 200mm |
| Thickness Accuracy | ±0.5 µm |
| Resolution | 50nm |
| Thickness range | 200 - 700 µm |
| Automatic wafer | no |
| Bow & Warp include gravity connection | no |
| Software | MXNT |
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