MX 204-8-37-B


Thickness, TTV, Bow, Warp


  • Automatic wafer geometry gauge
  • Wafer diameter 6" and 8"
  • Thickness range 200 - 700µm
  • Accuracy 1µm
  • Resolution 0.1µm
  • Software MXNT

Warp and Bow-bf do not include gravity correction

The Wafer Centering Station

In front of the wafer geometry station there is a wafer centering station, on which the operator lays down the wafer he wants to measure. Four posts with beveled ends center and support the wafer. When the operator has pressed the button on the front panel of the instrument to start the measurement, these posts retract and lay down the wafer on the vacuum chuck bars of the drawer. Provided the chuck has clamped the wafer, an electric motor pulls the tray into the geometry station and lowers it there in order to lay down the wafer on the lower probe plate.